World’s smallest UFS package promises faster performance and greater efficiency for flagship smartphones
Micron’s latest UFS 4.0 SSD, unveiled at the Mobile World Congress 2024, has set a new standard for mobile storage innovation. Boasting the world’s smallest UFS package at 9×13 millimeters, this latest SSD is built on Micron’s advanced 232-layer 3D NAND technology, providing up to 1TB of storage capacity.
The unveiling promises enhanced experiences on flagship smartphones, with sequential read speeds of 4300MBps and sequential write speeds of 4000MBps, effectively doubling the performance of previous generations.
The notable speed boost not only accelerates data-intensive experiences but also allows users to launch productivity, creativity, and AI applications with unprecedented speed. Micron claims that Loading Level Models (LLMs) in generative AI applications can be achieved up to 40% faster.
Micron’s UFS 4.0 isn’t just about raw speed; it introduces optimized performance through proprietary firmware features. The High-Performance Mode (HPM) is said to enhance performance during intensive smartphone use, resulting in a remarkable 25% improvement in speed when launching multiple applications. The One Button Refresh (OBR) feature automatically cleans and optimizes data, ensuring seamless operation.
Furthermore, the Zoned UFS (ZUFS) feature allows hosts to specify different zones for data storage, potentially improving device usefulness over time. The reduced package size opens doors for the design of energy-efficient, ultra-slim smartphones, while also accommodating larger batteries for extended usage.
Micron’s UFS 4.0 will be available in capacities of 256GB, 512GB, and 1TB, though pricing details are yet to be disclosed. This announcement marks a significant stride in mobile storage technology, promising a new era of efficiency and performance for flagship smartphones.
